Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AS8530-ASOP
|
Austria Micro Systems | 完全替代 |
LIN Transceiver with Integrated Vreg 5V 20kBd 8Pin SOIC EP T/R
|
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