Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 655
Encapsulation parameters/Encapsulation: FCBGA-655
External dimensions/length: 24.5 mm
External dimensions/width: 19.5 mm
External dimensions/height: 2.55 mm
External dimensions/packaging: FCBGA-655
External dimensions/thickness: 2.55 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: buffer
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
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