Technical parameters/descent time (Max): 0.0305 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 102 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 11
Encapsulation parameters/Encapsulation: Die
External dimensions/packaging: Die
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: optics
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review