Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: MSOP-8
External dimensions/packaging: MSOP-8
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADC122S051CIMMX/NOPB
|
TI | 完全替代 | VSSOP-8 |
2 通道、200 ksps 至 500 ksps 12 位模数转换器 8-VSSOP -40 to 85
|
||
ADC122S051CIMMX/NOPB
|
National Semiconductor | 完全替代 | TSSOP-8 |
2 通道、200 ksps 至 500 ksps 12 位模数转换器 8-VSSOP -40 to 85
|
||
ADC122S051QIMM/NOPB
|
TI | 完全替代 | VSSOP-8 |
2 通道、200 ksps 至 500 ksps 12 位模数转换器 8-VSSOP -40 to 85
|
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