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Model ADA4817-1ACP-EBZ
Description Analog Devices The high-speed universal evaluation board is designed to assist customers in quickly prototyping new high-speed operational amplifier circuits and reducing design time. These evaluation boards can be used with almost all Analog Devices dual operational amplifiers in various configurations and applications, enabling fast test circuit boards/prototyping design. User defined circuit configurations provide edge mounted SMA connectors for easy connection to test equipment and other circuits in compliance with RoHS. The following boards are provided: 794-4685 · ADA4817-1 for single operational amplifiers, using SOIC8 package 794-4651 · ADA4897-2 for dual operational amplifiers, using MSOP10 package 794-4689 · ADA4817-2 for dual operational amplifiers, using LFCSP16 package 917-6279 · HSAMP-2CPZ-8 for dual operational amplifiers, using LFCSP8 package 917-6272 · HSAMP-2RM. Z-10 is used for dual operational amplifiers, using MSOP10 package 917-6276 · HSAMP-2RMZ-8 for dual operational amplifiers, using MSOP8 package 917-6285 · HSAMP-2RZ-8 Used for dual operational amplifiers, using SOIC8 package # # operational amplifier, Analog Devices
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Brand: ADI
Packaging SOIC
Delivery time
Packaging method Box
Standard packaging quantity 1
123.52  yuan 123.52yuan
1+:
$ 142.0446
10+:
$ 138.3390
50+:
$ 135.4981
100+:
$ 134.5100
200+:
$ 133.7689
500+:
$ 132.7808
1000+:
$ 132.1632
2000+:
$ 131.5456
Quantity
1+
10+
50+
100+
200+
Price
$142.0446
$138.3390
$135.4981
$134.5100
$133.7689
Price $ 142.0446 $ 138.3390 $ 135.4981 $ 134.5100 $ 133.7689
Start batch production 1+ 10+ 50+ 100+ 200+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7576) Minimum order quantity(1)
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Technical parameters/power supply current: 21.0 mA

Technical parameters/input capacitance: 1.50 pF

Technical parameters/gain bandwidth product: 410 MHz

Technical parameters/input impedance: 500 GΩ

Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: SOIC

External dimensions/packaging: SOIC

Other/Product Lifecycle: Active

Other/Packaging Methods: Box

Other/Manufacturing Applications: Industrial, Consumer Electronics, Sensing & Instrumentation

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standards/military grade: No

Compliant with standard/REACH SVHC version: 2015/12/17

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