Technical parameters/output current: 900 mA
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TQFN-32
External dimensions/packaging: TQFN-32
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Other/Manufacturing Applications: processor
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review