Technical parameters/number of logic gates: 32000
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2.25V ~ 5.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: FBGA-144
External dimensions/length: 13 mm
External dimensions/width: 13 mm
External dimensions/height: 1.05 mm
External dimensions/packaging: FBGA-144
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microchip | 类似代替 | FBGA |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 144Pin FBGA
|
||
A54SX32A-FG144I
|
SOC | 完全替代 | LBGA-144 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 144Pin FBGA
|
||
A54SX32A-FG144I
|
Microsemi | 完全替代 | FBGA-144 |
FPGA SX-A Family 32K Gates 1800 Cells 238MHz 0.25um Technology 2.5V 144Pin FBGA
|
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