Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 176
Encapsulation parameters/Encapsulation: TQFP-176
External dimensions/packaging: TQFP-176
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Not For New Designs
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 功能相似 | LQFP-176 |
FPGA SX Family 16K Gates 924 Cells 280MHz 0.35um Technology 3.3V/5V 176Pin TQFP
|
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|
|
SOC | 功能相似 | LQFP-176 |
FPGA SX Family 16K Gates 924 Cells 280MHz 0.35um Technology 3.3V/5V 176Pin TQFP
|
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