Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 176
Encapsulation parameters/Encapsulation: LQFP-176
External dimensions/packaging: LQFP-176
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A42MX09-3TQ176
|
Microsemi | 功能相似 | LQFP-176 |
FPGA 42MX Family 14K Gates 336 Cells 177MHz/296MHz 0.45um Technology 3.3V/5V 176Pin TQFP
|
||
A42MX09-3TQ176
|
SOC | 功能相似 | LQFP-176 |
FPGA 42MX Family 14K Gates 336 Cells 177MHz/296MHz 0.45um Technology 3.3V/5V 176Pin TQFP
|
||
A42MX09-3TQ176
|
Microchip | 功能相似 | TQFP-176 |
FPGA 42MX Family 14K Gates 336 Cells 177MHz/296MHz 0.45um Technology 3.3V/5V 176Pin TQFP
|
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