Technical parameters/kernel architecture: AVR
Encapsulation parameters/Encapsulation: Module
External dimensions/packaging: Module
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Wireless, Wireless, portable devices, communication and networking, RF communication, RF Communications, portable devices, Communications&Networking
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
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