Technical parameters/number of pins: 3
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-3
External dimensions/packaging: TO-3
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
8080-1G25
|
Buchanan | 功能相似 |
Conn Transistor Socket SKT 3POS Solder ST Thru-Hole
|
|||
8080-1G25
|
TE Connectivity | 功能相似 | TO-3 |
Conn Transistor Socket SKT 3POS Solder ST Thru-Hole
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review