Technical parameters/number of circuits: 1
Technical parameters/power supply voltage: 2.375V ~ 3.8V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/length: 3 mm
External dimensions/width: 3 mm
External dimensions/height: 0.97 mm
External dimensions/packaging: TSSOP-8
External dimensions/thickness: 970 µm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
853S011BMILF
|
Integrated Device Technology | 完全替代 | SOIC-8 |
时钟缓冲器 1:2 LVPECL/ECL Fanout Buffer
|
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