Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 5.00 mm
External dimensions/width: 4.40 mm
External dimensions/packaging: TSSOP
External dimensions/thickness: 1.00 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
853S01AGILF
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
IC MUX 2:1 DIFF-LVPECL 16TSSOP
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review