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Model 1-84953-6
Description FFC Surface mount connectors - TE Connectivity With the increasing demand for high-density packaging of electronic devices, the use of flexible printed circuits (FPCs) to reduce size, weight, and cost is becoming increasingly popular. FPC is widely used in the computer industry, especially for Lap Top, Notebook, Palm Top, and Note Pad computers. Other markets include disk drives, printers, plotters, copiers, mobile phones, and medical equipment. Lead free electroplating is of the 90 ° type and comes with top or bottom contacts to choose from. The 1.0mm FFC compact and reliable interconnect technology is used for signal and data applications that require high-density flexible flat complex wire harnesses. These thin, zero or low insertion force FFC 1mm pitch flexible connection systems allow for easy insertion and removal of FFC cable components, avoiding direct welding of cables onto the board. Cable components of various lengths are ready and can be sold separately. Compact connector, available in ZIF and non ZIF types at a height above the low board, can maintain stable connection performance without sliding or lifting during operation when subjected to environmental pressure and mechanical stress
Product QR code
Brand: TE Connectivity
Packaging SMD
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
5.9  yuan 5.9yuan
10+:
$ 7.0752
100+:
$ 6.7214
500+:
$ 6.4856
1000+:
$ 6.4738
2000+:
$ 6.4266
5000+:
$ 6.3677
7500+:
$ 6.3205
10000+:
$ 6.2969
Quantity
10+
100+
500+
1000+
2000+
Price
$7.0752
$6.7214
$6.4856
$6.4738
$6.4266
Price $ 7.0752 $ 6.7214 $ 6.4856 $ 6.4738 $ 6.4266
Start batch production 10+ 100+ 500+ 1000+ 2000+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(6665) Minimum order quantity(10)
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Technical parameters/number of contacts: 16

Technical parameters/polarity: Female

Technical parameters/Contact electroplating: Tin

Technical parameters/rated current: 1 A

Technical parameters/number of rows: 1

Technical parameters/direction: Right Angle

Technical parameters/Flammability level: UL 94 V-0

Technical parameters/number of pins: 16

Technical parameters/shielding: No

Technical parameters/rated current (Max): 1A/contact

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/rated voltage (Max): 200 VAC

Technical parameters/rated voltage: 200 V

Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: SMD

Packaging parameters/pin spacing: 1.00 mm

External dimensions/length: 23.92 mm

External dimensions/width: 2.56 mm

External dimensions/height: 2.56 mm

External dimensions/packaging: SMD

External dimensions/pin spacing: 1.00 mm

Physical parameters/shell color: Natural

Physical parameters/color: Natural

Physical parameters/contact material: Phosphor Bronze

Physical parameters/materials: Thermoplastic

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Other/Manufacturing Applications: Signal, Computers & Computer Peripherals, Computers and computer peripherals, Industrial, Industrial

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/ELV standards: Compliant

Compliant with standards/REACH SVHC standards: No SVHC

Customs information/ECCN code: EAR99

Customs information/HTS code: 8536694040

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
1-84953-6 1-84953-6 TE Connectivity 功能相似 SMD
CONN FPC 16POS 1MM R/A SMD
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FFC3B10-16-T FFC3B10-16-T Global Connector Technology 功能相似 Surface Mount
GLOBAL CONNECTOR TECHNOLOGY FFC3B10-16-T 连接器, FFC/FPC, 母, 16路, 1排
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