Technical parameters/number of circuits: 1
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/length: 6.6 mm
External dimensions/width: 4.5 mm
External dimensions/height: 0.95 mm
External dimensions/packaging: TSSOP-20
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC2245APW,118
|
NXP | 类似代替 | TSSOP-20 |
3态总线收发
|
||
74LVC245APW,118
|
NXP | 类似代替 | TSSOP-20 |
74LVC245APW,118 编带
|
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