Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC827APW,112
|
Philips | 完全替代 | TSSOP |
Buffer/Line Driver 10CH Non-Inverting 3-ST CMOS 24Pin TSSOP Bulk
|
||
74LVC827APW,112
|
NXP | 完全替代 | TSSOP-24 |
Buffer/Line Driver 10CH Non-Inverting 3-ST CMOS 24Pin TSSOP Bulk
|
||
74LVC827APW,118
|
Nexperia | 完全替代 | TSSOP-24 |
74LVC827 系列 10 位 3态 缓冲器/线路驱动器 - TSSOP-14
|
||
74LVC841APW,118
|
NXP | 完全替代 | TSSOP-24 |
Latch Transparent 3-ST 10CH D-Type 24Pin TSSOP T/R
|
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