Technical parameters/power supply voltage (DC): 3.30 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LCX573MTCX
|
National Semiconductor | 功能相似 |
FAIRCHILD SEMICONDUCTOR 74LCX573MTCX 芯片, D型锁存器, 8位, 三态, TSSOP-20
|
|||
74LCX573MTCX
|
ON Semiconductor | 功能相似 | TSSOP-20 |
FAIRCHILD SEMICONDUCTOR 74LCX573MTCX 芯片, D型锁存器, 8位, 三态, TSSOP-20
|
||
74LVC573APW,118
|
Philips | 类似代替 | TSSOP-20 |
NXP 74LVC573APW,118 芯片, 锁存器, D型, 透明, 三态, TSSOP-20
|
||
74LVC573APW,118
|
NXP | 类似代替 | TSSOP-20 |
NXP 74LVC573APW,118 芯片, 锁存器, D型, 透明, 三态, TSSOP-20
|
||
74LVC573APW,118
|
Nexperia | 类似代替 | TSSOP-20 |
NXP 74LVC573APW,118 芯片, 锁存器, D型, 透明, 三态, TSSOP-20
|
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