Technical parameters/dissipated power: 500 mW
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 500 mW
Technical parameters/power supply voltage: 1.2V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC157AD,118
|
NXP | 完全替代 | SOIC-16 |
74LVC157AD,118 编带
|
||
74LVC257AD,112
|
NXP | 完全替代 | SOIC-16 |
多路复用器, LVC系列, 4路, 2:1, 1.65 V至3.6 V, SOIC-16
|
||
74LVC257APW,118
|
Nexperia | 类似代替 | TSSOP-16 |
NXP 74LVC257APW,118 芯片, 四路多路复用器, 8路输入, TSSOP-16
|
||
SN74LVC257APW
|
TI | 功能相似 | TSSOP-16 |
TEXAS INSTRUMENTS SN74LVC257APW 芯片, 逻辑电路 - 数据选择器/多路复用器
|
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