Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC1G175GW,165
|
NXP | 类似代替 | TSSOP-6 |
IC D-TYPE POS TRG SNGL SC88
|
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SN74LVC1G175DCKR
|
TI | 功能相似 | SC-70-6 |
TEXAS INSTRUMENTS SN74LVC1G175DCKR 触发器, 异步清零, 非反相, 正沿, D, 4 ns, 175 MHz, 50 mA, SC-70, 6 引脚
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SN74LVC1G175DCKR
|
TI | 功能相似 | SC-70-6 |
TEXAS INSTRUMENTS SN74LVC1G175DCKR 触发器, 异步清零, 非反相, 正沿, D, 4 ns, 175 MHz, 50 mA, SC-70, 6 引脚
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