Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 2.25 mm
External dimensions/width: 1.35 mm
External dimensions/height: 1 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC1G07GW,125
|
NXP | 类似代替 | SC-70-5 |
NXP 74LVC1G07GW,125. 逻辑芯片, 缓冲器, 非反相
|
||
74LVC1G07GW,125
|
Nexperia | 类似代替 | SOT-323-5 |
NXP 74LVC1G07GW,125. 逻辑芯片, 缓冲器, 非反相
|
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