Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: SOT-353
External dimensions/length: 2.2 mm
External dimensions/width: 1.35 mm
External dimensions/height: 1 mm
External dimensions/packaging: SOT-353
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Rochester | 功能相似 |
NXP 74LVC1G00GW 与非门, LVC系列, 1门, 2输入, 32 mA, 1.65V至5.5V, SOT-353-5
|
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74LVC1G00GW
|
Philips | 功能相似 | SOT-353 |
NXP 74LVC1G00GW 与非门, LVC系列, 1门, 2输入, 32 mA, 1.65V至5.5V, SOT-353-5
|
||
74LVC1G00GW,125
|
NXP | 功能相似 | SC-70-5 |
NXP 74LVC1G00GW,125. 芯片, 与非门, 单路, 2输入, TSSOP-5, 整卷
|
||
74LVC1G00GW,125
|
Nexperia | 功能相似 | SC-70-5 |
NXP 74LVC1G00GW,125. 芯片, 与非门, 单路, 2输入, TSSOP-5, 整卷
|
||
SN74LVC1G00DCKT
|
TI | 功能相似 | SC-70-5 |
74LVC1G 系列,Texas Instruments 低电压 CMOS 逻辑 单门封装 工作电压:1.65 - 5.5 兼容性:输入 LVTTL/TTL、输出 LVCMOS 按 JESD 78 II 级标准,闩锁效应性能超过 100 mA。 ESD 保护超乎 JESD 22 标准 ### 74LVC 系列
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