Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 9.90 mm
External dimensions/width: 3.90 mm
External dimensions/packaging: SOIC
External dimensions/thickness: 1.50 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LCX138M
|
ON Semiconductor | 功能相似 | SOIC-16 |
FAIRCHILD SEMICONDUCTOR 74LCX138M 芯片, 74LCX CMOS逻辑器件
|
||
74LCX138M
|
Fairchild | 功能相似 | SOIC-16 |
FAIRCHILD SEMICONDUCTOR 74LCX138M 芯片, 74LCX CMOS逻辑器件
|
||
74LCX138MX
|
Fairchild | 功能相似 | SOIC-16 |
FAIRCHILD SEMICONDUCTOR 74LCX138MX 芯片, 解码器/信号分离器, 1:8, NSOIC-16
|
||
74LCX138MX
|
ON Semiconductor | 功能相似 | SOIC-16 |
FAIRCHILD SEMICONDUCTOR 74LCX138MX 芯片, 解码器/信号分离器, 1:8, NSOIC-16
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review