Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC08APW
|
NXP | 功能相似 | TSSOP-14 |
AND Gate 4Element 2IN CMOS 14Pin TSSOP
|
||
74LVC08APW,118
|
NXP | 完全替代 | TSSOP-14 |
74LVC08APW,118 编带
|
||
74LVC08APW,118
|
Nexperia | 完全替代 | TSSOP-14 |
74LVC08APW,118 编带
|
||
74LVC08APW-Q100,11
|
Nexperia | 完全替代 | TSSOP-14 |
逻辑门 2-IN AND Gate 3.6V
|
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