Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LV4094PW,118
|
NXP | 功能相似 | TSSOP-16 |
74LV 系列 3.3 V 表面贴装 8-级 移位和存储 总线寄存器; 3 态 - TSSOP-16
|
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