Technical parameters/digits: 8
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/height: 1.45 mm
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LV165D,118
|
NXP | 完全替代 | SOIC-16 |
74LV 系列 8-位 并行输入/串行输出 移位寄存器
|
||
74LV165D,118
|
NXP | 完全替代 | SOIC-16 |
74LV 系列 8-位 并行输入/串行输出 移位寄存器
|
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