Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74HCT597E
|
TI | 功能相似 | DIP-16 |
TEXAS INSTRUMENTS CD74HCT597E 移位寄存器, HCT系列, 并行至串行、串行至串行, 1元件, DIP, 16 引脚, 4.5 V, 5.5 V
|
||
CD74HCT597E
|
Harris | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HCT597E 移位寄存器, HCT系列, 并行至串行、串行至串行, 1元件, DIP, 16 引脚, 4.5 V, 5.5 V
|
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