Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HCT4051D
|
Toshiba | 完全替代 | SOIC-16 |
NXP 74HCT4051D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT4051D
|
Nexperia | 完全替代 | SOIC |
NXP 74HCT4051D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT4051D
|
Philips | 完全替代 | SOIC-16 |
NXP 74HCT4051D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT4051D
|
NXP | 完全替代 | SOIC |
NXP 74HCT4051D 芯片, 74HCT CMOS逻辑器件
|
||
74HCT4051D
|
Rochester | 完全替代 |
NXP 74HCT4051D 芯片, 74HCT CMOS逻辑器件
|
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