Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-20
External dimensions/packaging: DIP-20
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Nexperia | 类似代替 | DIP |
NXP 74HC540N 芯片, 74HC CMOS逻辑器件
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||
74HC540N
|
NXP | 类似代替 | DIP-20 |
NXP 74HC540N 芯片, 74HC CMOS逻辑器件
|
||
CD54HC540F3A
|
Harris | 功能相似 | DIP |
高速CMOS逻辑八路缓冲器和线路驱动器,三态 High-Speed CMOS Logic Octal Buffer and Line Drivers, Three-State
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