Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-16
External dimensions/packaging: DIP-16
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Harris | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HC85E 逻辑芯片, 比较器, 高速, 4位, 16DIP
|
||
CD74HC85E
|
TI | 功能相似 | PDIP-16 |
TEXAS INSTRUMENTS CD74HC85E 逻辑芯片, 比较器, 高速, 4位, 16DIP
|
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