Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Nexperia | 功能相似 |
AND-OR Gate 2Element 2 Wide 2IN/3IN CMOS 14Pin SO Bulk
|
|||
|
|
Nexperia | 功能相似 | SO |
AND-OR Gate 2Element 2 Wide 2IN/3IN CMOS 14Pin SO T/R
|
||
74HC58D,653
|
NXP | 功能相似 | SOIC-14 |
AND-OR Gate 2Element 2 Wide 2IN/3IN CMOS 14Pin SO T/R
|
||
74HC58DB,118
|
NXP | 功能相似 | SSOP-14 |
74hc58 - 双路与或门
|
||
74HC58DB,118
|
Nexperia | 功能相似 | SSOP-14 |
74hc58 - 双路与或门
|
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