Technical parameters/number of channels: 16
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 500 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 15.6 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.45 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74HC4067M96
|
TI | 类似代替 | SOIC-24 |
TEXAS INSTRUMENTS CD74HC4067M96 芯片, 模拟多路复用器/信号分离器, 单路, 16:1, SOIC-24
|
||
MC14067BDWG
|
ON Semiconductor | 功能相似 | SOIC-24 |
ON SEMICONDUCTOR MC14067BDWG 芯片, 4000系列 CMOS逻辑器件
|
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