Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-16
External dimensions/packaging: DIP-16
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MM54HC174J
|
National Semiconductor | 功能相似 | DIP |
HC/UH SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16
|
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