Technical parameters/number of output interfaces: 1
Technical parameters/digits: 8
Technical parameters/number of inputs: 9
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 2V ~ 6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: New Product
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC165D
|
Nexperia | 类似代替 | SOIC |
NXP 74HC165D 移位寄存器, HC系列, 并行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC165D
|
Toshiba | 类似代替 | SOIC-16 |
NXP 74HC165D 移位寄存器, HC系列, 并行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC165D
|
NXP | 类似代替 | SOIC-16 |
NXP 74HC165D 移位寄存器, HC系列, 并行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC165D
|
Philips | 类似代替 | SOP |
NXP 74HC165D 移位寄存器, HC系列, 并行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC165D
|
Motorola | 类似代替 | SOP |
NXP 74HC165D 移位寄存器, HC系列, 并行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC165D,653
|
Nexperia | 类似代替 | SOIC-16 |
NXP 74HC165D,653 移位寄存器, HC系列, 并行至串行, 8元件, SOIC, 16 引脚, 2 V, 6 V
|
||
SN74HC165DR
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS SN74HC165DR 移位寄存器, HC系列, 并行至串行、串行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
SN74HC165DR
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS SN74HC165DR 移位寄存器, HC系列, 并行至串行、串行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
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