Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/packaging: TFSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVT16827DGG,112
|
NXP | 功能相似 | SOT-364-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST BiCMOS 56Pin TSSOP Tube
|
||
74ALVT16827DGG,118
|
Nexperia | 功能相似 | SOT-364-56 |
Buffer/Line Driver 20CH Non-Inverting 3-ST BiCMOS 56Pin TSSOP T/R
|
||
74ALVT16827DGGS
|
Nexperia | 功能相似 | TFSOP-56 |
IC BUFFER/DVR 3ST 20Bit 56TSSOP
|
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