Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVT16823DL
|
NXP | 功能相似 | SSOP |
18位总线接口D型双稳态多谐振荡器具有复位和使能三态 18-bit bus-interface D-type flip-flop with reset and enable 3-State
|
||
74ALVT16823DL
|
Nexperia | 功能相似 | SSOP |
18位总线接口D型双稳态多谐振荡器具有复位和使能三态 18-bit bus-interface D-type flip-flop with reset and enable 3-State
|
||
74ALVT16823DL,518
|
NXP | 完全替代 | BSSOP-56 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 2Element 56Pin SSOP T/R
|
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