Technical parameters/number of circuits: 18 Bit
Technical parameters/number of channels: 18
Technical parameters/dissipated power: 600 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 600 mW
Technical parameters/power supply voltage: 2.3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/height: 1.05 mm
External dimensions/packaging: TSSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16500DGG,11
|
Nexperia | 完全替代 | TFSOP-56 |
Bus XCVR Single 18CH 3-ST 56Pin TSSOP T/R
|
||
74ALVCH16500DGG,11
|
NXP | 完全替代 | TSSOP-56 |
Bus XCVR Single 18CH 3-ST 56Pin TSSOP T/R
|
||
74ALVCH16500DGG:11
|
NXP | 完全替代 | TSSOP-56 |
Bus XCVR Single 18CH 3-ST 56Pin TSSOP T/R
|
||
74ALVCH16500DGGS
|
NXP | 完全替代 | TFSOP-56 |
Bus XCVR Single 18CH 3-ST 56Pin TSSOP Tube
|
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