Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 8.60 mm
External dimensions/width: 3.90 mm
External dimensions/packaging: SOIC
External dimensions/thickness: 1.50 mm
Other/Product Lifecycle: Obsolete
Compliant with standards/lead standards: Contains Lead
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