Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 功能相似 | TSSOP |
Inverter Schmitt Trigger 6Element CMOS 14Pin TSSOP
|
||
74AHCT14PW
|
NXP | 功能相似 | TSSOP-14 |
Inverter Schmitt Trigger 6Element CMOS 14Pin TSSOP
|
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