Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Aftermarket
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TC74ACT245P
|
Toshiba | 类似代替 | PDIP-20-6 |
Bus XCVR Single 8CH 3-ST 20Pin PDIP Tube
|
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