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Model 72V263L7-5BCI
Description First in first out 8K x 18/16K x 9 SuperSync II, 3.3V
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Brand: Integrated Device Technology
Packaging BGA-100
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1554) Minimum order quantity(1)
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Technical parameters/number of circuits: 1

Technical parameters/access time: 10 ns

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): -40 ℃

Package parameters/number of pins: 100

Encapsulation parameters/Encapsulation: BGA-100

External dimensions/length: 11 mm

External dimensions/width: 11 mm

External dimensions/height: 1.4 mm

External dimensions/packaging: BGA-100

External dimensions/thickness: 1.40 mm

Physical parameters/operating temperature: -40℃ ~ 85℃

Other/Product Lifecycle: Not Recommended for New Designs

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72V263L7-5BCGI 72V263L7-5BCGI Integrated Device Technology 功能相似 LBGA-100
FIFO, 8KX18, 5ns, Synchronous, CMOS, PBGA100, 11 X 11MM, 1MM PITCH, GREEN, BGA-100
PDF
SN74V263-6GGM SN74V263-6GGM TI 功能相似 BGA-100
8192 】 18 ， 16384 】 18 ， 32768 】 18 ：65536 】 18 3.3 V的CMOS先入先出MEMORIES 8192 】 18, 16384 】 18, 32768 】 18, 65536 】 18 3.3-V CMOS FIRST-IN, FIRST-OUT MEMORIES

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