Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/length: 14.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: TQFP-64
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 完全替代 |
1K x 1K TSI, 8 I/O at 8Mbps, 3.3V
|
|||
IDT72V70810TF8
|
Integrated Device Technology | 类似代替 | LQFP-64 |
1K x 1K TSI, 8 I/O at 8Mbps, 3.3V
|
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