Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/packaging: TQFP-64
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT72V36100L10PF
|
Integrated Device Technology | 功能相似 | LQFP |
3.3伏高密度SUPERSYNC ™ II 36位的FIFO 3.3 VOLT HIGH-DENSITY SUPERSYNC⑩ II 36-BIT FIFO
|
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