Technical parameters/access time: 14ns, 4.5ns
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: BGA-324
External dimensions/length: 19.0 mm
External dimensions/width: 19.0 mm
External dimensions/packaging: BGA-324
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V285L10PFG
|
Integrated Device Technology | 功能相似 | TQFP-64 |
先进先出 3.3V 64K X 18 SUPER SYNC
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72V285L10PFG8
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72V285L10PFG8
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Integrated Device Technology | 功能相似 | LQFP-64 |
先进先出 3.3V 64K X 18 SUPER SYNC
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72V285L10TFG
|
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先进先出 3.3V 64K X 18 SUPER SYNC
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