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Model 72T36125L10BB
Description FIFO Mem Async/Sync Dual Depth/Width Uni-Dir 256K x 36 240Pin BGA
Product QR code
Brand: Integrated Device Technology
Packaging BGA-240
Delivery time
Packaging method Tray
Standard packaging quantity 1
824.22  yuan 824.22yuan
1+:
$ 939.6142
10+:
$ 906.6453
50+:
$ 902.5242
100+:
$ 898.4031
150+:
$ 891.8093
250+:
$ 886.0397
500+:
$ 880.2702
1000+:
$ 873.6764
Quantity
1+
10+
50+
100+
150+
Price
$939.6142
$906.6453
$902.5242
$898.4031
$891.8093
Price $ 939.6142 $ 906.6453 $ 902.5242 $ 898.4031 $ 891.8093
Start batch production 1+ 10+ 50+ 100+ 150+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7584) Minimum order quantity(1)
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Technical parameters/access time: 14ns, 4.5ns

Technical parameters/power supply voltage: 2.375V ~ 2.625V

Technical parameters/power supply voltage (Max): 2.625 V

Technical parameters/power supply voltage (Min): 2.375 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 240

Encapsulation parameters/Encapsulation: BGA-240

External dimensions/length: 19.0 mm

External dimensions/width: 19.0 mm

External dimensions/packaging: BGA-240

External dimensions/thickness: 1.76 mm

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72T36125L5BBGI 72T36125L5BBGI Renesas Electronics 类似代替 BGA-240
先进先出 2.5V 256 X 36 TERASYNCH F
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