Technical parameters/power supply current: 145 mA
Technical parameters/access time: 10 ns
Technical parameters/power supply voltage: 3.15V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 32
Encapsulation parameters/Encapsulation: TSOP-32
External dimensions/length: 20.9 mm
External dimensions/width: 10.2 mm
External dimensions/packaging: TSOP-32
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71V124HSA10PH
|
Integrated Device Technology | 完全替代 | TSOP |
SRAM Chip Async Single 3.3V 1M-bit 128K x 8 10ns 32Pin TSOP-II Tube
|
||
71V124SA10PHG
|
Integrated Device Technology | 完全替代 | TSOP-32 |
SRAM Chip Async Single 3.3V 1M-Bit 128K x 8 10ns 32Pin TSOP-II Tube
|
||
IDT71V124SA10PH
|
Integrated Device Technology | 类似代替 | SOIC-32 |
3.3V CMOS静态RAM 1兆欧( 128K ×8位)中心电源和接地引脚 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout
|
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