Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: CDIP
External dimensions/length: 37.2 mm
External dimensions/width: 15.2 mm
External dimensions/packaging: CDIP
External dimensions/thickness: 1.65 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Integrated Device Technology | 功能相似 | CDIP |
CMOS静态RAM 64K ( 8K ×8位) CMOS STATIC RAM 64K (8K x 8-BIT)
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