Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 128
Encapsulation parameters/Encapsulation: TQFP-128
External dimensions/length: 20.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: TQFP-128
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V3319S133PRF
|
Integrated Device Technology | 完全替代 | TQFP-128 |
SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 128Pin TQFP
|
||
70V3319S133PRFI
|
Integrated Device Technology | 完全替代 | TQFP-128 |
SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 15ns/4.2ns 128Pin TQFP Tray
|
||
70V631S12PRFI
|
Integrated Device Technology | 完全替代 | TQFP-128 |
Dual-Port SRAM, 256KX18, 12ns, CMOS, PQFP128, 14 X 20MM, 1.4MM HEIGHT, TQFP-128
|
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