Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 272
Encapsulation parameters/Encapsulation: PBGA-272
External dimensions/length: 27.0 mm
External dimensions/width: 27.0 mm
External dimensions/packaging: PBGA-272
External dimensions/thickness: 2.00 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V3389S4BCG
|
Integrated Device Technology | 类似代替 | LBGA-256 |
IC SRAM 1.125Mbit 4.2NS 256CABGA
|
||
70V3389S5BCI
|
Integrated Device Technology | 类似代替 | LBGA-256 |
IC SRAM 1.125Mbit 5NS 256CABGA
|
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