Technical parameters/power supply voltage: 3.15V ~ 3.45V
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/length: 17.0 mm
External dimensions/width: 17.0 mm
External dimensions/packaging: LBGA-256
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V3319S133BC8
|
Integrated Device Technology | 完全替代 | LBGA-256 |
IC SRAM 4.5Mbit 133MHz 256CABGA
|
||
70V3319S133BCGI
|
Integrated Device Technology | 完全替代 | LBGA-256 |
IC SRAM 4.5Mbit 133MHz 256CABGA
|
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