Package parameters/number of pins: 84
Encapsulation parameters/Encapsulation: PGA
External dimensions/length: 27.9 mm
External dimensions/width: 27.9 mm
External dimensions/packaging: PGA
External dimensions/thickness: 3.68 mm
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7024S55G
|
Integrated Device Technology | 功能相似 | PGA |
高速4K ×16双口静态RAM HIGH-SPEED 4K x 16 DUAL-PORT STATIC RAM
|
||
IDT70V24S55PFG
|
Integrated Device Technology | 功能相似 | LQFP |
HIGH-SPEED 3.3V STATIC RAM
|
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